In an era where high-frequency applications are increasingly vital, the demand for superior printed circuit boards (PCBs) has never been greater. The RO4350B PCB, crafted from advanced Rogers materials, represents a significant advancement in this field, offering exceptional performance and cost-effectiveness for engineers and designers alike.
Understanding Rogers RO4350B Materials
At the core of the RO4350B PCB's success is its unique composition. Rogers RO4350B materials combine woven glass reinforcement with hydrocarbon/ceramics, delivering electrical performance that rivals traditional PTFE options while ensuring manufacturability similar to epoxy/glass. This innovative construction enables tight control over dielectric constant (Dk) and minimizes loss, making it ideal for high-frequency applications.
Key Properties of RO4350B PCBs
The RO4350B PCB boasts a dielectric constant of 3.48 ± 0.05 at 10 GHz, ensuring minimal signal degradation. Its dissipation factor of 0.0037 enhances energy efficiency, a critical requirement for modern high-speed electronics. These attributes make RO4350B PCBs a reliable choice for various applications, from telecommunications to automotive sensors.
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.66 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0037
0.0031 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 5.7 x109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432)
14,153(2,053) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5)
130(18.9) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255
(37) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.5 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10
12
32 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 390 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.69 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.86 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 0.88
(5.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | (3)V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Cost-Effectiveness Without Compromise
One of the most compelling reasons to choose RO4350B PCBs is their cost-effectiveness. These boards are manufactured using processes similar to those of standard FR-4 materials, allowing for reduced fabrication costs. Engineers can achieve high-performance results at a fraction of the cost associated with traditional microwave laminates, making RO4350B a smart choice for budget-conscious projects.
Dimensional Stability and Thermal Resistance
Dimensional stability is crucial in high-frequency designs, and the RO4350B PCB excels in this regard. Its thermal coefficient of expansion closely matches that of copper, ensuring reliable performance in multi-layer board constructions. The PCB features a two-layer stackup with:
- Copper Layer Thickness: 35 μm on both layers.
- Rogers RO4350B Core Thickness: 0.338 mm (13.3 mil).
- Finished Board Thickness: 0.5 mm.
Additionally, with a glass transition temperature (Tg) exceeding 280°C (536°F), the RO4350B maintains its structural integrity even under extreme thermal conditions.
Water Absorption and Reliability
The RO4350B PCB features a low water absorption rate of just 0.06%, which enhances its reliability in diverse environments. This characteristic helps prevent delamination and ensures long-term durability, making it suitable for applications where moisture exposure is a concern.
Versatile Applications Across Industries
The versatility of RO4350B PCBs makes them ideal for various high-frequency applications. They are widely used in:
- Cellular Base Station Antennas: Supporting the growing demand for mobile connectivity.
- RF Identification Tags: Facilitating efficient tracking solutions.
- Automotive Radar and Sensors: Enhancing safety and precision in vehicle systems.
- LNBs for Direct Broadcast Satellites: Delivering high-quality signal transmission.
Quality Assurance and Testing Standards
Every PCB undergoes rigorous 100% electrical testing before shipment, adhering to IPC-Class-2 quality standards. This commitment to quality ensures that each board meets the highest performance expectations, providing peace of mind for engineers and designers.
Conclusion: The Future of PCB Technology
In summary, the RO4350B PCB is a revolutionary solution for high-frequency applications, combining performance, reliability, and cost-effectiveness. With its advanced material properties and versatile applications, it stands ready to meet the challenges of modern electronics.
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