RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick
This 4-layer rigid PCB uses aerospace-grade F4BTM450 material to deliver superior electrical, thermal, and mechanical performance for high-frequency, mission-critical systems. Meeting IPC-Class-2 standards, it provides a high-reliability solution for aerospace, microwave, and military applications and serves as a competitive alternative to premium imported options.
PCB Specification
| Parameter |
Specification |
| Base Material |
F4BTMS450 (advanced PTFE-nano-ceramic composite) |
| Layer Configuration |
4-layer rigid PCB |
| Board Dimensions |
20mm x 20mm per unit (tolerance: ±0.15mm) |
| Finished Board Thickness |
1.4mm |
| Copper Weight (Finished) |
1oz (1.4 mils / 35μm) |
| Via Plating Thickness |
20μm |
| Minimum Trace/Space |
4 mils / 5 mils |
| Minimum Hole Size |
0.3mm |
| Vias |
4 total (no blind vias) |
| Surface Finish |
Immersion Gold |
| Silkscreen |
Top: No; Bottom: No |
| Solder Mask |
Top: No; Bottom: No |
| Quality Assurance |
100% Electrical test prior to shipment |
Precise PCB Stack-up
- Copper Layer 1: 35μm (1oz)
- F4BTMS450 Core: 0.127mm (5mil)
- Copper Layer 2: 35μm (1oz)
- Prepreg RO4450F: 0.102mm (4mil)
- F4BTMS450 Core: 0.127mm (5mil)
- Copper Layer 3: 35μm (1oz)
- Prepreg RO4450F: 0.102mm (4mil)
- F4BTMS450 Core: 0.762mm (30mil)
- Copper Layer 4: 35μm (1oz)
F4BTMS450 Material Advantages
F4BTMS450 is an upgraded iteration of the F4BTM series, featuring a breakthrough formulation of polytetrafluoroethylene (PTFE) resin, ultra-thin/ultra-fine glass fiber cloth, and uniformly distributed special nano-ceramics. Key benefits include:
- Minimized electromagnetic wave propagation interference from glass fibers, reducing dielectric loss.
- Enhanced dimensional stability and reduced X/Y/Z anisotropy, ensuring consistency across extreme conditions.
- Extended usable frequency range, improved electrical strength, and superior thermal conductivity.
- Low thermal expansion coefficient and stable dielectric temperature characteristics.
- Standard RTF (Reverse Treat Foil) low-roughness copper foil, reducing conductor loss and delivering excellent peel strength (compatible with copper or aluminum bases).
F4BTMS450 Key Electrical & Mechanical Properties
| Property |
Specification |
| Dielectric Constant (Dk) |
4.5 ±0.09 (10GHz) |
| Dissipation Factor (Df) |
0.0015 (10GHz); 0.0019 (20GHz) |
| Coefficient of Thermal Expansion (CTE) |
X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 45 ppm/°C (-55°C to 288°C) |
| Thermal Coefficient of Dk |
-58 ppm/°C (-55°C to 150°C) |
| Flame Rating |
UL-94 V0 |
| Thermal Conductivity |
0.64 W/MK |
| Moisture Absorption |
0.08% (max) |
Typical Applications
This PCB is ideal for demanding environments and high-performance systems, including:
- Aerospace equipment, space vehicles, and cabin systems
- Microwave and RF (Radio Frequency) devices
- Military radar and general radar systems
- Feed networks for high-frequency applications
- Phase-sensitive antennas and phased array antennas
- Satellite communications systems
- Other mission-critical electronics requiring stable performance under extreme temperatures and conditions.
