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Double-sided TMM4 PCB 15mil Thick with Immersion Gold Finish

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Double-sided TMM4 PCB 15mil Thick with Immersion Gold Finish

Brand Name : Bicheng

Model Number : BIC-470.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : Rogers TMM4

Layer count : 2 layers

PCB thickness : 0.5mm

PCB size : 102mm x 85mm per piece, with a tolerance of +/- 0.15mm

Solder mask : No

Silkscreen : No

Copper weight : 1oz (1.4 mils) for outer layers

Surface finish : Immersion Gold

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This PCB is a high-performance 2-layer rigid board, constructed with strict adherence to industry standards and precise specifications to ensure reliability and functionality. It adopts Rogers TMM4 thermoset microwave material as the base material, which is suitable for RF and microwave circuitry, satellite communication systems, GPS antennas and other high-frequency applications.

PCB specification

Item Details
Base Material Rogers TMM4
Layer Count 2 layers (no blind vias)
Board Dimensions 102mm x 85mm per piece, with a tolerance of +/- 0.15mm
Minimum Trace/Space 5/7 mils
Minimum Hole Size 0.4mm
Finished Board Thickness 0.5mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Silkscreen No silkscreen on both top and bottom layers
Solder Mask No solder mask on both top and bottom layers
Quality Control 100% Electrical test conducted prior to shipment

PCB Stack-up

Layer Specifications & Descriptions
Copper Layer 1 35 μm (1oz finished copper)
Rogers TMM4 Core 0.381 mm (15 mil) core substrate
Copper Layer 2 35 μm (1oz finished copper)

Double-sided TMM4 PCB 15mil Thick with Immersion Gold Finish

Artwork and Standard

Type of Artwork Supplied: Gerber RS-274-X, the global industry standard for PCB fabrication, compatible with mainstream manufacturing equipment and software to ensure accurate design data transfer and reduce fabrication errors.

Accepted Standard: IPC-Class-2 (formulated by IPC), a widely used PCB quality standard that ensures acceptable performance for general electronic applications with moderate reliability requirements, balancing quality and cost-effectiveness.

Availability

This PCB is available for worldwide shipping to meet global demand.

Introduction to Rogers TMM4 Base Material

Rogers TMM4 is a thermoset microwave material composed of ceramic, hydrocarbon, and thermoset polymer composite. It is specifically designed for high plated-thru-hole reliability in strip-line and micro-strip applications, integrating the advantages of both ceramic and traditional PTFE laminates without the need for specialized production techniques. As a thermoset resin-based laminate, TMM4 ensures reliable wire-bonding performance without pad lifting or substrate deformation, making it ideal for high-frequency and high-reliability applications.

Key Features of Rogers TMM4 Material

Key Features of Rogers TMM4 Material Specifications & Descriptions
Dielectric Constant (Dk) 4.50 +/- 0.045 (stable and precise for signal transmission)
Dissipation Factor 0.0020 at 10GHz (low loss, suitable for high-frequency applications)
Thermal Coefficient of Dk 15 ppm/°K (stable dielectric performance across temperature variations)
Coefficient of Thermal Expansion (CTE) Matched to copper; x=16 ppm/°K, y=16 ppm/°K, z=21 ppm/°K (reduces thermal stress and improves reliability)
Decomposition Temperature (Td) 425 °C (TGA) (high thermal stability)
Thermal Conductivity 0.7 W/mk (effective heat dissipation)
Moisture Absorption 0.07% - 0.18% (low moisture absorption, ensuring performance in humid environments)
Available Thickness Range 0.0015 to 0.500 inches (+/- 0.0015”) (flexible for different design requirements)

Benefits of Using Rogers TMM4 Material

-Mechanical Properties: Resists creep and cold flow, maintaining structural integrity over time

-Chemical Resistance: Resistant to process chemicals, reducing damage during PCB fabrication

-Wire-Bonding Reliability: Thermoset resin base enables reliable wire-bonding without pad lifting or substrate deformation

-High Plated Through-Hole Reliability: Ensures stable electrical connection and long service life

-Process Compatibility: Compatible with all common printed wiring board (PWB) processes, simplifying fabrication and reducing production costs

Typical Applications

-RF and microwave circuitry

-Power amplifiers and combiners

-Filters and couplers

-Satellite communication systems

-Global Positioning Systems (GPS) Antennas

-Patch Antennas

-Dielectric polarizers and lenses

-Chip testers

Double-sided TMM4 PCB 15mil Thick with Immersion Gold Finish


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