This is a customized 2-layer rigid high-frequency PCB fabricated with Wangling TF300 high-performance dielectric substrate, designed for high-stability microwave and millimeter-wave circuits and miniature antenna systems. The board is finished with immersion gold, with no solder mask or silkscreen applied on either top or bottom surfaces.
PCB Specification
| Parameter Item | Specification |
| Base Material | TF300 high-frequency dielectric material |
| Layer Count | 2 layers rigid PCB |
| Board Dimensions | 70mm × 49mm (1 piece), dimensional tolerance: ±0.15mm |
| Minimum Trace / Space | 5 mils / 5 mils |
| Minimum Mechanical Hole Size | 0.3mm |
| Via Type | No blind vias adopted; only through-hole vias are used |
| Finished Board Thickness | 0.7mm |
| Outer Layer Finished Copper Weight | 1oz (1.4 mils) |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold |
| Silkscreen Layer | No top and bottom silkscreen |
| Solder Mask Layer | No top and bottom solder mask |
| Quality Test | 100% electrical test before shipment |
PCB Layer Stack-up Structure
| Layer Name | Specification |
| Copper Layer 1 (Top Layer) | 35μm finished copper thickness |
| Dielectric Core | Wangling TF300 high-frequency material, 0.635mm (25mil) thickness |
| Copper Layer 2 (Bottom Layer) | 35μm finished copper thickness |
Artwork & Quality Standards
Artwork Format: Manufactured based on standard Gerber RS-274-X files, the industry-standard format ensuring high-precision patterning and full production compatibility.
Quality Standard: Manufactured and inspected in accordance with IPC-Class-2 reliability specifications, meeting general commercial and industrial-grade performance requirements.
Supply Coverage: Available for worldwide shipment with standardized production and complete quality control, supporting stable global delivery.
Wangling TF Series Material Overview
Wangling TF series substrates are high-performance high-frequency dielectric materials composed of PTFE resin and ceramic filler, featuring a fiberglass-free structure. The dielectric constant can be precisely tuned by adjusting the ceramic-to-PTFE ratio. Manufactured via proprietary processes, TF-series materials deliver outstanding microwave performance, superior thermal stability and long-term reliability, making them ideal for high-precision high-frequency PCB designs.
Core Material Performance Features
Tunable & Stable Dielectric Performance
TF300 features a stable, tunable DK of 3.0–16 with multiple standard options and ultra-low dielectric loss, perfectly meeting microwave and millimeter-wave circuit fabrication requirements.
Wide Temperature Stability
It enables continuous stable operation at -80℃ to +200℃, delivering outstanding thermal adaptability for harsh aerospace and industrial environments.
Customizable Thickness & High Processability
This material supports customized thickness ranging from 0.635mm to 2.5mm and is fully compatible with standard thermoplastic PCB manufacturing processes for high production yield.
Reliable Environmental Adaptability
With excellent radiation resistance and ultra-low outgassing properties, it maintains stable electrical and mechanical performance in extreme high-reliability working scenarios.
TF300 Typical Material Properties
| Dielectric Constant (DK) | 3.0±0.06 @10 GHz |
| Dissipation Factor (DF) | 0.001 @10 GHz |
| Thermal Coefficient of Dielectric Constant (TCDK) | -60 ppm/℃ (-55℃~150℃) |
| Peel Strength (1oz Copper) | ＞0.6 N/mm |
| Coefficient of Thermal Expansion (CTE) | X/Y Axis: 60 ppm/℃; Z Axis: 80 ppm/℃ |
| Water Absorption | ≤0.05% (20±2℃, 24 h) |
| Density | 2.41 g/cm3 |
| Thermal Conductivity | 0.3 W/m·K |
| Applicable Copper Foil | Standard electrolytic copper foil: 0.5oz, 1oz |
Typical Application Scenarios
Aerospace equipment, space systems, aircraft and in-cabin electronic equipment
Microwave circuits, high-frequency antennas and phase-sensitive antenna devices
Early warning radars, airborne radars and radar signal processing modules
Phased array antennas and beamforming network systems
Satellite communication and navigation equipment
High-frequency power amplifier modules
