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2-layer TFA294 PCB Low-loss Microwave Circuits with Immersion Gold

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2-layer TFA294 PCB Low-loss Microwave Circuits with Immersion Gold

  • 1
  • 2

Layer count : 2 layers

Base material : TFA294 glass-free ceramic PTFE composite substrate

Solder mask : No

Copper weight : 1oz

Surface finish : Immersion gold

Silkscreen : No

PCB thickness : 1.1mm

PCB size : 97.53mm × 100.28mm (1 piece), tolerance: ±0.15mm

Brand Name : Bicheng

Model Number : BIC-273.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

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This custom 2-layer rigid high-frequency PCB utilizes aerospace-grade TFA294 glass-free ceramic PTFE composite dielectric substrate. Engineered for ultra-stable, low-loss microwave and millimeter-wave applications, the board features immersion gold surface finishing with a fully solder mask-free and silkscreen-free double-sided structure. Every unit undergoes 100% electrical testing prior to shipment, ensuring superior consistency and long-term reliability for high-end RF and aerospace electronic systems.

PCB Specifications

Parameter Item Specification
Base Material TFA294 glass-free ceramic PTFE composite substrate
Layer Count 2-layer rigid PCB
Board Dimensions 97.53mm × 100.28mm (1 piece), tolerance: ±0.15mm
Minimum Trace / Space 4 mils / 6 mils
Minimum Mechanical Hole Size 0.35mm
Via Type Only through-hole vias, no blind vias
Finished Board Thickness 1.1mm
Finished Copper Weight 1oz (1.4 mils) for outer layers
Via Plating Thickness 20μm
Surface Finish Immersion Gold
Silkscreen Layer Silkscreen-free on both top and bottom sides
Solder Mask Layer Fully solder mask-free on both sides
Quality Test 100% electrical testing implemented prior to shipment

PCB Layer Stack-up Structure

Layer Name Specification
Copper Layer 1 (Top) 35μm finished copper thickness
Dielectric Core TFA294 ceramic PTFE substrate, 1.016mm (40mil) thickness
Copper Layer 2 (Bottom) 35μm finished copper thickness

2-layer TFA294 PCB Low-loss Microwave Circuits with Immersion Gold

Artwork & Quality Standards

Artwork Format: Fabricated with standard Gerber RS-274-X files to ensure precise circuit patterning and full manufacturing compatibility.

Quality Standard: All fabrication and inspection processes comply rigorously with IPC-Class-2 reliability specifications for stable performance and long-term structural durability.

Service Coverage: support global delivery and reliable product supply for international high-frequency PCB projects.

TFA Series Material Overview

The TFA series represents advanced glass-free PTFE ceramic composite dielectric substrates, adopting innovative nano-ceramic mixing and specialized lamination processes instead of traditional glass fiber impregnation manufacturing. Eliminating the fiberglass effect during electromagnetic wave propagation, this material minimizes X/Y/Z-axis anisotropy and delivers ultra-uniform electrical, thermal and mechanical properties. It features excellent frequency stability, ultra-low dielectric loss and copper-matched thermal expansion performance. Available with four customizable dielectric constants (2.94, 3.0, 6.15, 10.2), the TFA series serves as high-reliability, aerospace-grade alternatives to imported high-frequency substrates.

2-layer TFA294 PCB Low-loss Microwave Circuits with Immersion Gold

TFA294 Core Features & Benefits

Stable Dielectric Performance: Delivers a stable DK of 2.94 at 10GHz and ultra-low DF of 0.0010 (10/20GHz) / 0.0012 (40GHz), enabling low-loss broadband and millimeter-wave signal transmission.

Ultra-Low TCDK: Maintains a minimal TCDK of -5 ppm/°C across -55°C to 150°C, guaranteeing steady dielectric properties under extreme temperature variations.

Balanced Low CTE: Features matched CTE values (18 ppm/°C X/Y, 32 ppm/°C Z-axis) in the range of -55°C to 288°C, mitigating thermal stress and enhancing PTH structural reliability.

Efficient Thermal Dissipation: With 0.59 W/mk thermal conductivity, it rapidly dissipates operational heat and prevents performance degradation under continuous high-power working conditions.

Low Moisture Sensitivity: Ultra-low 0.03% moisture absorption prevents electrical parameter drift in humid environments, ensuring long-term stable circuit operation.

Typical Application Scenarios

Leveraging glass-free structure, ultra-low loss, extreme temperature stability and minimal anisotropy, TFA294 PCBs are ideal for high-precision and phase-sensitive high-frequency systems in aerospace, military and satellite communication fields:

  • Aerospace and airborne equipment, aircraft in-cabin electronic systems
  • High-precision microwave circuits and phase-sensitive antenna systems
  • Early warning radars and airborne radar devices
  • Phased array antennas and beamforming networks
  • Satellite communication and navigation systems
  • High-frequency power amplifier modules

2-layer TFA294 PCB Low-loss Microwave Circuits with Immersion Gold


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