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Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask

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Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask

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Brand Name : Bicheng

Model Number : BIC-062.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : Ceramic-PTFE composite

Layer count : 1 Layer, 2 Layer

PCB thickness : 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm), 75mil (1.90mm)

PCB size : ≤400mm X 500mm

Solder mask : Green, Black, Blue, Yellow, Red etc.

Copper weight : 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

Surface finish : Bare copper, HASL, ENIG, Immersion tin, OSP.

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Rogers RT/Duroid 6006 High Frequency PCB

Rogers RT/duroid 6006 microwave laminates are ceramic-PTFE composites which are designed for electronic and microwave circuit applications requiring a high dielectric constant. RT/duroid 6006 laminate is available with a dielectric constant value of 6.15.

Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask

RT/duroid 6006 microwave laminates feature ease of fabrication and stability in use. This property results in the possibility of mass production and reducing the cost of goods. It has tight dielectric constant and thickness control, low moisture absorption, and good thermal mechanical stability.

Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask

Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask

RT/Duroid 6006 printed circuit boards are widely used in aircraft collision avoidance systems, ground radar warning systems, patch antennas and satellite communications systems etc.

RT/duroid 6006 Typical Value
Property RT/duroid 6006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.15 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped stripline
Dielectric Constant,εDesign 6.45 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0027 Z 10 GHz/A IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -410 Z ppm/℃ -50℃-170℃ IPC-TM-650 2.5.5.5
Volume Resistivity 7 x 107 Mohm.cm A IPC 2.5.17.1
Surface Resistivity 2 x 107 Mohm A IPC 2.5.17.1
Tensile Properties ASTM D638 (0.1/min. strain rate)
Young's Modulus 627(91) 517(75) X Y MPa(kpsi) A
Ultimate Stress 20(2.8) 17(2.5) X Y MPa(kpsi) A
Ultimate Strain 12 to 13 4 to 6 X Y % A
Compressive Properties ASTM D695 (0.05/min. strain rate)
Young's Modulus 1069 (115) Z MPa(kpsi) A
Ultimate Stress 54(7.9) Z MPa(kpsi) A
Ultimate Strain 33 Z %
Flexural Modulus 2634 (382) 1951 (283) X MPa(kpsi) A ASTM D790
Ultimate Stress 38 (5.5) X Y MPa(kpsi) A
Deformation under load 0.33 2.1 Z Z % 24hr/50℃/7MPa 24hr/150℃/7MPa ASTM D261
Moisture Absorption 0.05 % D48/50℃ 0.050"(1.27mm) thick IPC-TM-650 2.6.2.1
Thermal Conductivity 0.49 W/m/k 80℃ ASTM C518
Coefficient of Thermal Expansion 47
34
117		 X
Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.41
Td 500 ℃ TGA ASTM D3850
Density 2.7 g/cm3 ASTM D792
Specific Heat 0.97(0.231) j/g/k
(BTU/ib/OF)		 Calculated
Copper Peel 14.3 (2.5) pli (N/mm) after solder float IPC-TM-650 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes

Rogers RT/Duroid 6006 High Frequency PCB With Green Solder Mask


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Duroid 6006 High Frequency PCB

      

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